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| Intro |
Introduction to Pin in Paste Intrusive Reflow |
| Chapter 1 |
Pin In Hole Reflow PCB Design Guidelines |
| Chapter 2 |
PIHR Component Guidelines |
| Chapter 3 |
Solder Paste Application Methods |
| Chapter 4 |
Automatic and Manual Component Placement |
| Chapter 5 |
Reflow Soldering |
| Chapter 6 |
Temperature Profiling for Pin In Paste Reflow |
| Chapter 7 |
Solder Joint Inspection and Quality Control |
| Chapter 8 |
Reliability of Through Hole Reflow |
| Chapter 9 |
PIHR Manufacturing Defects – Causes and Cures |
| Chapter 10 |
PIHR Bibliography |
| Chapter 11 |
PIHR Frequently Asked Questions |